Analyst. Semiconductors, data centers & physical Al.
Portfolio and investment theses on Substack Join 14,000+ readers: https://t.co/sA44Nk15PWHyperTechinvest.com SpainJoined April 2011
$TSM and $ASX Break Ground on Taiwan’s First Advanced Packaging Cluster
TSMC, ASE, Foxconn, and more than 20 semiconductor companies have begun developing Taiwan’s first advanced packaging supply-chain cluster in Kaohsiung. The first phase is already fully allocated
ASE expects advanced packaging and testing capacity shortages to persist for another 3–5 years. Most of its planned capacity additions over the next three years are already booked. The company has seven new factories under construction, three undergoing equipment installation, and two additional plants planned
TSMC will establish two facilities focused on CoWoS and panel-level packaging (PLP) technology validation, while Foxconn will develop an AI computing and smart manufacturing base
Separately, ASE’s $3.4 billion advanced testing park is scheduled to begin operations in April 2027, with annual production value expected to reach $5.6 billion at full capacity
Unitree Launches A Humanoid Robot Hand for $6,000
Unitree Robotics is attacking the dextrous hand bottleneck with the Dex5-S, a dexterous robotic hand with 22 degrees of freedom, up from 20 in its previous model
The new hand weighs 620 grams, supports a maximum payload of 2 kg and a continuous working load of 1 kg. The Pro version adds tactile sensing
Prices start at $6,000 per hand
$FSLR Continues Patent Lawsuits Against Solar Rivals
First Solar plans to withdraw its ITC complaint and resume patent lawsuits against $CSIQ, Jinko Solar, $TE, and Trina Solar in US courts
First Solar holds TOPCon patents but manufactures CdTe thin-film solar cells, giving it little incentive to settle through cross-licensing
Patent litigation, combined with US tariffs, is making it harder for foreign TOPCon manufacturers to enter the US market
Some manufacturers are turning to alternative technologies to avoid the dispute, including PERC and heterojunction (HJT) solar cells
Development by 2028 and mass production by 2030 was always the predicted timeline, to be fair
$LPK, Absolics, Rapidus, and SEMCO were aiming for mass production by 2028, but that seems unlikely, at least not at a large scale across the industry
Korean media reports that Nvidia has asked substrate makers in South Korea, Japan, and Taiwan to complete glass substrate development within two years, potentially before 2028.
kipost.net/news/articleVi…