SaranonK🇹🇭 @sunzz220

@danielisdizzy $NFLX managements have ever disappointed investors before. Can we blindly trust them? BC the growth isn’t looking good like before(I once trusted them).

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SaranonK🇹🇭 @sunzz220

3 days ago

@wallstengine Hopefully Gemini4 can beat competitor models.

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SaranonK🇹🇭 @sunzz220

3 days ago

GDP is above expectation. PCE is below expectation Stock is going to the moon, right?

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SaranonK🇹🇭 @sunzz220

4 days ago

$HOOD expands access to tradingwith 24/7 equities trading, longer options hours for major symbols. More hours, more trading fee? Trading platform stocks are overlooked. $IBKR $BULL $FUTU

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SaranonK🇹🇭 @sunzz220

5 days ago

When the fear and greed index go below 20 next time, don’t miss again. Buy when blood on the street. Wait for the best shot and swing for the homerun.

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In 2026, inflation is gonna skyrocket, Fed is gonna hike aggressively, market is gonna crash like 2022. No, I don’t think so. Why? Because the companies in S&P500 talk and care less about inflation. Why you still do? Just focus the real business fundamental.

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SaranonK🇹🇭 @sunzz220

5 days ago

@gurgavin Shift from hunting staff level to management level, $META is all-in to be the winner of AI model game.

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SaranonK🇹🇭 @sunzz220

5 days ago

$NVDA just approved another $150 Billion to the buyback program . The buyback program now has total $235 Billion to that MUST BUY stocks by 2028. Good job Huang.

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SaranonK🇹🇭 @sunzz220

6 days ago

The takeaway The next leg of AI compute performance isn't about fitting more transistors on one die, it's about how you stack, probe, inspect, and package them together. The market is still treating packaging suppliers like low-margin cyclical assembly shops. That mispricing is where the alpha lives. Which packaging or metrology name are you buying for this cycle? Drop your comment below 👇

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SaranonK🇹🇭 @sunzz220

6 days ago

5/ Kulicke & Soffa ($KLIC) - The Thermal Compression When silicon stacks get ultra-dense, traditional wire bonding doesn't cut it. You need Thermo-Compression Bonding (TCB). • Legacy assembly play transforming into an advanced HBM/CPO packaging powerhouse • Fiscal Q3 revealed a sharp operational rebound off cyclical lows • Massive structural tailwind if TCB becomes mandatory for 16-Hi HBM stacks

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SaranonK🇹🇭 @sunzz220

6 days ago

Everyone is busy betting on which GPU or CPU name will dominate the AI era. Smart money is quietly positioning around the actual physical bottleneck, which is the Advanced Packaging. More server CPUs = taller HBM stacks, bigger chiplets, and packaging complexity going vertical. Here are 5 under-the-radar stocks printing cash off this secular AI boom👇